stainless steel hollow desoldering needle
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A stainless steel hollow desoldering needle is designed specifically for desoldering applications where precision and control are required. It features a hollow, tubular design with a sharp tip that allows it to effectively suction molten solder from PCB holes during the desoldering process.
Key Features:
- Material: Stainless steel for durability and resistance to corrosion.
- Hollow Design: Allows the needle to suction molten solder through its interior during desoldering.
- Tip: Sharp and pointed to access and clean PCB holes effectively.
- Handle: May include a handle or grip for ergonomic use and control.
- Applications: Used in electronics repair, PCB rework, and prototyping to remove solder from through-holes and clean PCB pads.
- Preparation: Heat the solder joint with a soldering iron to melt the solder.
- Desoldering: Place the hollow desoldering needle over the molten solder and allow it to suction the solder into its hollow interior.
- Cleaning: Clear the desoldering needle periodically to prevent clogging and ensure effective desoldering.
- Enables precise and clean removal of solder from PCB holes.
- Reduces the risk of damaging components or PCB traces during desoldering.
- Facilitates efficient PCB rework and repair tasks.
Technical Specifications:
- Logic Family: CMOS
- Number of Channels: 3
- Switch Configuration: Single-Pole Double-Throw (SPDT)
- Supply Voltage Range: 3V to 15V
- “ON” Resistance (R_ON): 125Ω typical at V_DD = 10V
- “OFF” Leakage Current (I_OFF): ±100pA typical at V_DD = 10V
- Control Input Voltage (V_IH): 0.7 V_DD min, 0.3 V_DD max
- Maximum Operating Frequency: 40 MHz at V_DD = 10V
Applications:
- Signal routing and switching
- Analog and digital multiplexing
- Audio and video signal processing
- Data acquisition systems
- Test equipment